Diamond Polishing Paste Medium Lapping #1000 60gm **Diamond Polishing Paste Medium** Diamond Polishing Paste Medium consists of micron-sized synthetic diamonds, natural diamonds, polymicron diamonds, or CBN particles. This compound is designed for lapping, polishing, and finishing applications, delivering consistent and high-quality results. The diamond paste is ideal for a variety of uses, including mold polishing, dies, metallurgical processes, metalwork, hard disk drives, wire dies, stone and construction, semiconductors, electro-optics, and ceramics. **Tailored Formulations** Hyperion provides customized lapping and polishing paste formulations, which are available with both water-soluble and oil-soluble carriers. These tailored solutions ensure optimal performance for each specific application. – **Water-Soluble Compound Paste** . Experts highly recommend it for use in universities, R&D laboratories, and metallurgical manufacturers, particularly for specimen preparation and cross-section analysis. The water-soluble paste ensures thorough cleaning while minimizing contamination risks. – **Oil-Soluble Compound Paste:** This variant is ideal for controlled lapping of carbide drawing dies, cold heading dies, and other polishing applications. Mold and die polishing frequently benefits from this paste, where precise control and high-quality finishes are essential. **Enhanced Productivity** Hyperion also offers both water-based and oil-based soluble products to enhance lapping productivity and facilitate cleaning. These products are crucial for applications that need to minimize corrosion and cannot tolerate oil. The choice between water-based and oil-based products depends on the specific needs of the application, ensuring that the paste provides the best performance while meeting operational requirements. By selecting the appropriate formulation, you can achieve optimal results in your lapping and polishing tasks, benefiting from Hyperion’s expertise in delivering effective and efficient solutions for a wide range of industrial and research applications.
